Innovations in Quantum Computing, 3D Printing, Robots, and Artificial Intelligence

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Published: 21 Dec 2018

This edition of the Inside R&D TOE depicts the current landscape and the new trends associated with quantum computing and 3D printing for electronic circuitry. It also focuses on innovations in underwater robots and artificial intelligence. Inside R&D TechVision Opportunity Engine (TOE) covers global innovations that are in research and development in virtually all technology areas. We provide intelligence and insights on innovations spanning a wide variety of industry areas, including automation, electronics, sensors, information and communication technologies, manufacturing, health, wellness, medical devices, pharma, biotechnology, materials, coatings, renewable fuels, automotive, power systems, sustainable energy solutions and innovations that contribute to a cleaner and greener environment. Keywords: Quantum computing, underwater robots, artificial intelligence, AI, rendering


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