Innovations in Heads-up Displays, Multi-view Displays, Optical Phototransistors, Smart Switches, Advanced Memory Storage, and Wireless Charging

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Published: 15 Mar 2019

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI, chips, heads-up displays, multi-view displays, optical phototransistors, wireless charging, smart switches, advanced data storage, and rectennas. Innovations include voice controlled HUDs, light- based smartswitches, 3D NAND memory architecture, retinal projection technology, superscatters, converting Wi-FI signals to electricity, AR glasses, and AI processors. The Microelectronics TOE captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs). Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory. Keywords: AI chipset, artificial intelligence, head-up display, HUD, rectenna, 3D NAND, ADAS, AR, augmented reality, wireless charging



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