Microelectronics Technology Alert. Hybrid Memory Cube Technology Offers High-Memory Bandwidth; Micromirror-Based Laser Beam Scanning System To Scan The Hemisphere; Stacked Silicon Interconnect Technology Facilitates Multi-Die FPGA

This issue profiles a hybrid memory cube technology that offers high-memory bandwidth, a micromirror-based laser beam scanning system to scan the hemisphere, and a stacked silicon interconnect technology that facilitates multi-die FPGA.