Chemicals, Materials & Food


Microelectronics Technology Alert. Hybrid Memory Cube Technology Offers High-Memory Bandwidth; Micromirror-Based Laser Beam Scanning System To Scan The Hemisphere; Stacked Silicon Interconnect Technology Facilitates Multi-Die FPGA

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This issue profiles a hybrid memory cube technology that offers high-memory bandwidth, a micromirror-based laser beam scanning system to scan the hemisphere, and a stacked silicon interconnect technology that facilitates multi-die FPGA.

Click headings to expand and collapse Published: 8 Jun 2012
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