Chemicals, Materials & Food

Microelectronics Technology Alert. Hybrid Memory Cube Technology Offers High-Memory Bandwidth; Micromirror-Based Laser Beam Scanning System To Scan The Hemisphere; Stacked Silicon Interconnect Technology Facilitates Multi-Die FPGA

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Published: 8 Jun 2012

This issue profiles a hybrid memory cube technology that offers high-memory bandwidth, a micromirror-based laser beam scanning system to scan the hemisphere, and a stacked silicon interconnect technology that facilitates multi-die FPGA.



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