Measurement & Instrumentation


Overview of the Interposer Technology in Packaging Applications

Published: 1 Oct 2018

The miniaturization of chips and the need for increased functionality and enhanced operating performance with a smaller footprint will drive the need for heterogeneous integrations. Such integrations are facilitated by various methodologies such as wafer level fan out (WLFO), embedded multi-die interconnect bridge (EMIB), and interposers amongst others. Interposers for systems in package will become more important for advanced electronic systems, especially for 2.5D and 3D IC applications, due to the proven benefits of silicon interposers with through silicon vias (TSV). Since Mega Trends such as the Internet of Things (IoT) and connected and self-driving cars will necessitate higher bandwidth data processing and communications, the need for high-performance electronic systems will increase further. This will, in turn, drive the interposers market as chip scaling has reached economical limits, and advancements in packaging have been the key focus for advancing electronics on a chip-scale. But the growth of interposer technology is also dependent on addressing challenges, performance, and cost barriers induced by the interposer materials.

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