Global Advances in Electronic/Chip Packaging (Technical Insights)

Date Published: 31 Dec 2007
Deliverable Type: Technical Insights

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.

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1. Executive Summary
- Scope and Methodology
  - Scope
  - Methodology
- Research Overview and Key Findings
  - Research Overview
  - Key Findings
2. Chip Packaging--Technology Outlook
- Technology Evolution in the Silicon IC Industry
  - Introduction to Chip Packaging Technologies
  - Growth Patterns in the Silicon IC Industry
- Advanced Chip Packaging -- Technology Primer
- Adoption Factors for the Chip Packaging Industry
  - Industry Challenges
  - Technology Drivers and Restraints
3. Technology Enablers for Chip Packaging
- Wafer and Surface Mount Technologies
  - Trends in the Wafer Industry--Evolution of SOI
  - Advances in Surface Mount Devices Placement Technology
- Interconnect Technologies and Signal Integrity
  - Interconnects--Technologies and Processes
  - Signal Integrity and Modeling--Issues and Challenges
4. Technology Development and Adoption Postures in Chip Packaging Industry
- Technology Trends
- 3D Integration Industry Trends; Analyst Insights
  - Industry Outlook on 3D Integration
  - Analyst Insights
5. Noteworthy Development Initiatives in the Chip Packaging Industry
- Innovative Chip and Board Packaging Technologies--World
- Signal Integrity and IP Developments--World
6. Key Patents and Contacts in the Chip Packaging Industry
- Key Patents Related to this Sector
  - Patents I
  - Patents II
- Key Contacts
  - Corporate Contacts
  - Universities and Research Labs
7. Decision Support Database
- Decision Support Database Tables

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1. Executive Summary

2. Chip Packaging--Technology Outlook

3. Technology Enablers for Chip Packaging

4. Technology Development and Adoption Postures in Chip Packaging Industry

5. Noteworthy Development Initiatives in the Chip Packaging Industry

6. Key Patents and Contacts in the Chip Packaging Industry

7. Decision Support Database

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