Global Advances in Electronic/Chip Packaging (Technical Insights)
Published: 31 Dec 2007
The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Tools
Features of this research
SUBSCRIPTIONS
- Technical Insights - Electronics & Security
- Technical Insights - Chemicals, Materials and Food
- Technical Insights - Semiconductors
- Total Technical Insights (Research Services Only)
- Technical Insights - Electronic Devices
- Technical Insights - Chemicals & Materials
- Chemicals and Advanced Materials Technology Cluster
- Microelectronics Technology Cluster
Help Desk
For more information and general enquiries, contact Frost & Sullivan near you.
Select a location near you..