Global Advances in Electronic/Chip Packaging (Technical Insights)

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Published: 31 Dec 2007

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.

1. Executive Summary
- Scope and Methodology
  - Scope
  - Methodology
- Research Overview and Key Findings
  - Research Overview
  - Key Findings
2. Chip Packaging--Technology Outlook
- Technology Evolution in the Silicon IC Industry
  - Introduction to Chip Packaging Technologies
  - Growth Patterns in the Silicon IC Industry
- Advanced Chip Packaging -- Technology Primer
- Adoption Factors for the Chip Packaging Industry
  - Industry Challenges
  - Technology Drivers and Restraints
3. Technology Enablers for Chip Packaging
- Wafer and Surface Mount Technologies
  - Trends in the Wafer Industry--Evolution of SOI
  - Advances in Surface Mount Devices Placement Technology
- Interconnect Technologies and Signal Integrity
  - Interconnects--Technologies and Processes
  - Signal Integrity and Modeling--Issues and Challenges
4. Technology Development and Adoption Postures in Chip Packaging Industry
- Technology Trends
- 3D Integration Industry Trends; Analyst Insights
  - Industry Outlook on 3D Integration
  - Analyst Insights
5. Noteworthy Development Initiatives in the Chip Packaging Industry
- Innovative Chip and Board Packaging Technologies--World
- Signal Integrity and IP Developments--World
6. Key Patents and Contacts in the Chip Packaging Industry
- Key Patents Related to this Sector
  - Patents I
  - Patents II
- Key Contacts
  - Corporate Contacts
  - Universities and Research Labs
7. Decision Support Database
- Decision Support Database Tables

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