Materials and Process Innovations for Digital Printing, Electronics, Direct Imaging, and Multisensing Applications

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Published: 23 Feb 2018

This issue of High-Tech Materials covers materials and process innovations for digital printing, electronics, direct imaging, and multisensing applications. These innovations can be used in a wide variety of applications such as food packaging, food safety and quality control, high-heat applications, electronics, wearables, building and construction, and printed circuit boards (PCBs). The High-Tech Materials TechVision Opportunity Engine (TOE) provides intelligence on technologies, products, processes, applications, and strategic insights on various materials across industries. Some material technologies include lightweight materials, bio–based materials, ceramics, smart materials, fibers, nanomaterials, responsive materials, polymers, woven and non woven materials, polymers and plastics and packaging materials. The Chemicals and Advanced Materials cluster tracks research and innovation trends and developments across specialty chemicals, plastics, polymers, chemicals, bio-chemicals, metals, coatings, thinfilms, surface treatments, composites, alloys, oil and gas, fuel additives, fibers, and several other related technologies and its impact and application across industries. Keywords: Resins, digital printing, multisensors, biobased polyurethanes, electronics, building and construction, printed circuit boards, direct imaging


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