Global Advances in Electronic/Chip Packaging (Technical Insights)

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Published: 31 Dec 2007

This Frost & Sullivan research service titled Global Trends in Electronic/Chip Packaging provides an insight into various development initiatives around the globe in advanced packaging, current development scenario of 3D packaging technologies, adoption factors and technology development strengths, and gaps in the field of advanced packaging technologies. In this research, Frost & Sullivan's expert analysts thoroughly examine the following technologies: System on Chip, System in Package, Stacked Package, Stacked Die package, and 3D Packages.

This analysis is available through our Technical Insights subscription. With this program, clients receive industry-leading market research such as this, along with technical and econometric data and many interactive features including Analyst Inquiry Time and Client Council.

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