Global Advances in Electronic/Chip Packaging (Technical Insights)
The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Published: 31 Dec 2007
The following technologies are covered in this research:
- System on chip (SoS)
- System in package (SiP)
- Stacked package
- Stacked die package
- 3D packages
Features of this Research
- Back to Report Homepage
- Report Overview
- Technologies
- Analyst Presentation
- Extended TOC
- View Brochure
Help Desk
For more information and general enquiries, contact Frost & Sullivan near you.
Select a location near you..