Global Advances in Electronic/Chip Packaging (Technical Insights)

The research service discusses global trends in electronic/chip packaging. It discusses in detail, development and adoption trends of advanced packaging technologies like System-in-Package (SiP) and 3D packaging. It further highlights the new developments in this sector.
Published: 31 Dec 2007

The following technologies are covered in this research:

  • System on chip (SoS)
  • System in package (SiP)
  • Stacked package
  • Stacked die package
  • 3D packages

Features of this Research

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